Ag-Sn Alloy Nanoparticles/Nanoparticles (<100nm, 99.9%)

Ag-Sn Alloy Nanoparticles/Nanoparticles

• Ag-Sn Alloy Nanoparticles/Nanoparticles are to a great extent attention-grabbing because their properties are flexible and can be very distinct from the particles of their constituents. The optical properties of alloy nanoparticles can be different by side effects and the composition of their pure components.
• Ag-Sn Alloy Nanoparticles/Nanoparticles offer a unique set of advantages as a lead-free soldering material. In nanoparticle states, they can reflow at lower temperatures leading to less thermal stresses in adjacent electronic components during the manufacturing process. After the initial reflow and solder joint formation (bulk state), they can reclaim bulk Au-Sn properties including permanent high melting temperatures (up to 420 °C) which can potentially lead to superior thermal and mechanical performance suitable for high-temperature electronic applications such as aerospace.
• Melting temperatures of Ag-Sn Alloy Nanoparticles/Nanopowder in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn–Pb eutectic temperature have received increasing attention models also predict that with decreasing particle size, the eutectic composition shifts towards the Sn-rich corner.
• Ag-Sn Alloy Nanoparticles/Nanopowder pastes on a Cu surface showed the typical Cu6Sn5 intermetallic compound (IMC) formation. These low melting points SnAg alloy nanoparticles could be used for low-temperature lead-free interconnect applications.