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Ag-Sn Alloy Nanoparticles/Nanoparticles (<100nm, 99.9%)


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Ag-Sn Alloy Nanoparticles/Nanoparticles (<100nm, 99.9%)

Ag-Sn Alloy Nanoparticles/Nanoparticles (<100nm, 99.9%)
Product No. CAS No. Formula Molecular Weight APS Purity Color Form
NRE-2035 7440-22-4/7440-31-5 Ag-Sn 226.5782 g/mol <100nm  (Can be Customized) 99.9% Grey-black Nanopowder
Density 1.2-1.6 g/cm³
Melting Point 1221°C
Boiling Point 1402°C

Ag-Sn Alloy Nanoparticles

  • Ag-Sn Alloy Nanoparticles/Nanoparticles are to a great extent attention-grabbing because their properties are flexible and can be very distinct from the particles of their constituents. Optical properties of alloy nanoparticles can be different by size effects and composition of their pure components.
  • Ag-Sn Alloy Nanoparticles/Nanoparticles offer a unique set of advantages as a lead-free soldering material. In nanoparticle state, they can reflow at lower temperatures leading to less thermal stresses in adjacent electronic components during the manufacturing process. After the initial reflow and solder joint formation (bulk state), they can reclaim bulk Au-Sn properties including permanent high melting temperatures (up to 420 °C) which can potentially lead to superior thermal and mechanical performance suitable for high-temperature electronic applications such as military and aerospace.
  • Melting temperatures of Ag-Sn Alloy Nanoparticles/Nanoparticles in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn–Pb eutectic temperature have received increasing attention model also predicts that with decreasing particle size, the eutectic composition shifts towards the Sn-rich corner.
  • Ag-Sn Alloy Nanoparticles/Nanoparticles pastes on a Cu surface showed the typical Cu6Sn5 intermetallic compound (IMC) formation. These low melting points SnAg alloy nanoparticles could be used for low-temperature lead-free interconnect applications.

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