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Boron Carbide Sputtering Target

Boron Carbide Sputtering Target

Boron Carbide Sputtering Target
Product No NRE-43019
CAS No. 12069-32-8
Formula  B4C
Molecular Weight 55.25 g/mol
Purity >99.9%
Density 2.52 g/cm³
Thickness 3 mm ± 0.5mm (can be customized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Electronegativity NA

Boron Carbide Sputtering Target

Boron carbide (B₄C) is a material with unique properties that make it highly suitable for specific applications, including sputtering targets. Sputtering is a process used to deposit thin films of material onto a substrate in various industries, including electronics, optics, and materials science. Here’s how boron carbide sputtering targets fit into different applications.

Semiconductor Industry: Boron carbide targets are used to deposit thin films of boron carbide onto semiconductor substrates. These films can serve as hard coatings or protective layers. The hardness and chemical stability of boron carbide make it useful for creating durable and wear-resistant surfaces.

Hard Coatings: Boron carbide is renowned for its hardness and high melting point. When used as a sputtering target, it can deposit coatings that provide excellent resistance to abrasion and wear. These coatings are useful in industrial tools and components subjected to high-stress conditions.

Optical Coatings: In optical applications, boron carbide films can be used to produce coatings with specific refractive indices. These coatings can be employed in optical filters, mirrors, and lenses where durability and precision are crucial.

Nuclear Applications: Boron carbide is known for its neutron-absorbing properties. Sputtered boron carbide films can be used in nuclear reactors for neutron shielding and control.

Electronics: In electronics, boron carbide coatings can be applied to various components to improve their durability and performance. The material’s high thermal stability and hardness make it suitable for protecting sensitive electronic parts.

When using boron carbide sputtering targets, it’s essential to consider factors such as target purity, sputtering conditions, and film adhesion to ensure optimal performance and quality of the deposited films.

 

 

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