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Copper Sputtering Target (Cu, Purity: 99.99%)

Copper Sputtering Target

Copper Sputtering Target
Product No NRE-43042
CAS No. 7440-50-8
Formula Cu
Molecular Weight 63.547 g/mol
Purity 99.99%
Density 8.96 g/cm³
Thickness 3 mm ± 0.5mm (can be customized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Thermal Expansion NA

Copper Sputtering Target

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