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Hafnium Fluoride Sputtering Targets

Hafnium Fluoride Sputtering Targets

Hafnium Fluoride Sputtering Targets
Product No NRE-43439
CAS No. 13709-52-9
Formula HfF4
Molecular Weight 254.48
Purity >99.9%
Density 7.1 g/cm3
Thickness 3 mm ± 0.5mm (can be customized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Thermal Conductivity NA

Hafnium Fluoride Sputtering Targets

Introduction

Hafnium fluoride (HfF₄) sputtering targets are specialized materials used in the sputtering process for depositing thin films in various applications. Sputtering is a widely employed technique in material science, particularly for creating thin layers of materials on substrates for electronics, optics, and coatings.

Applications

Semiconductor Manufacturing:

HfF₄ is utilized in the production of high-k dielectric films, which are essential for modern transistors and capacitors. These films improve the performance of devices by allowing for reduced size and increased capacitance.

Optical Coatings:

In optics, hafnium fluoride is used to create anti-reflective coatings and mirrors. Its optical properties enhance the efficiency and performance of lenses and optical devices.

Protective Coatings:

HfF₄ provides excellent thermal stability and chemical resistance, making it suitable for protective layers in harsh environments, such as aerospace components or industrial machinery.

Microelectromechanical Systems (MEMS):

The material is used in MEMS fabrication, where thin films contribute to the functionality and reliability of miniature devices.

Research and Development:

Hafnium fluoride targets are also valuable in research settings, enabling the exploration of new materials and thin film technologies for various applications.

Overall, hafnium fluoride sputtering targets play a vital role in enhancing the performance and functionality of advanced technologies across multiple sectors.

 

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