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Molybdenum Silicide Sputtering Target

Molybdenum Silicide Sputtering Target

Molybdenum Silicide Sputtering Target
Product No NRE-43108
CAS No. 12136-78-6
Formula MoSi2
Molecular Weight 152.11 g/mol
Thickness 3 mm ± 0.5mm (can be customized)
Diameter 50 mm ± 1mm (can be customized)
Density 6.3g/cm3
Purity 99.99%
Melting Point 2,030 °C
Boiling Point 2,959°C

Molybdenum Silicide Sputtering Target

Introduction

Molybdenum silicide sputtering targets are materials used in physical vapor deposition (PVD) processes to create thin films of molybdenum silicide. MoSi₂ is a refractory compound known for its excellent mechanical, thermal, and electrical properties, making it a valuable material in various high-temperature and high-performance applications.

Applications

Electronics:

Thin Film Transistors (TFTs): Used in the fabrication of TFTs, particularly in display technologies and flexible electronics, providing stable and conductive layers.

Interconnects: Employed as a material for electrical interconnects in integrated circuits due to its conductivity and thermal stability.

Aerospace and Defense:

High-Temperature Components: MoSi₂ is utilized in components exposed to extreme temperatures, such as turbine blades and other aerospace applications.

Heat Shields: Used in heat shields for spacecraft, benefiting from its thermal resistance.

Protective Coatings:

Molybdenum silicide films can serve as protective coatings on various substrates, enhancing wear resistance and oxidation resistance, thus extending the life of tools and components.

Energy Applications:

Heating Elements: MoSi₂ is used in high-temperature heating elements due to its thermal stability and conductivity.

Catalysis: Investigated for its potential as a catalyst support in various chemical reactions.

Metal Matrix Composites:

MoSi₂ is incorporated into metal matrix composites to enhance the mechanical properties of materials used in high-performance applications.

 

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