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Pure Copper Foam ( Cu, Purity: 99.9%, Thickness: 4mm)

Pure Copper Foam
Product No NRE-51015
CAS 7440-50-8
PPI 50
Density 8.94 g/mL
Purity ≥99.8%
Porosity ≥90%
Dimension 500mm * 500mm
Thickness 4mm
Melting Point 1083.4 °C
Bulk Thermal Conductivity 5.84 BTU/ft-hr-F

Pure Copper Foam

Pure Copper Foam, which is a three-dimensional network of interconnected copper strands, has several unique properties that make it suitable for various applications. Some of the notable applications of copper foam include:

Heat Exchangers:

Pure Copper Foam is an excellent heat conductor. It is used in heat exchangers to enhance heat dissipation in electronic devices, automotive radiators, and other cooling systems.

Thermal Insulation:

Despite being a good conductor of heat, copper foam can also be utilized as a thermal insulator. By trapping air within its porous structure, it can provide effective insulation in certain applications.

Catalyst Support:

Pure Copper Foam can be used as a support material for catalysts in chemical reactions. Its high surface area and porous structure provide a large active area for catalytic reactions.

Electromagnetic Shielding:

The conductive properties of copper foam make it suitable for electromagnetic interference (EMI) shielding applications. It can be used to protect electronic devices from external electromagnetic radiation.

Biomedical Applications:

Copper foam has been explored for use in biomedical applications, such as bone scaffolds and wound dressings. Its porous structure allows for cell growth, making it potentially useful in tissue engineering.

Energy Storage Devices:

Copper foam can be employed in energy storage devices, such as batteries and supercapacitors. Its high surface area can enhance electrode performance, leading to improved energy storage capacity.

Filtration Systems:

The porous nature of copper foam makes it suitable for use in filtration systems. It can be employed as a filter medium for gas or liquid filtration in various industries.