Shape Memory Polymer Resin (Potting)
| Shape Memory Polymer Resin (Potting) | |
| Product No. | NRE-54021 |
| CAS | 25038-59-9 |
| Glass Transition temp | 55°C |
| Melting Temp | 200°C |
| Specific Gravity | 1.25 |
| Temperature Stability | at 300°C |
| Tensile Strength | ~13Mpa (Rubber Region) |
| Elongation | >600% |
| Bending Modulus | 1900 (Glassy Region) |
| Bending Strength | 50MPa (Glassy Region) |
| Colour Tone | Light Yellow |
| A/B Weight Ratio | 40/60 |
| Viscosity Sol A | 360 |
| Viscosity Sol B | 300 |
| Specific Gravity Sol A | 1.062 |
| Specific Gravity Sol B | 1.215 |
| Strength | G/R |
| Bending Strength | 75 Mpa |
| Bending Modulus | 1800 Mpa |
| Tensile Strength | 52 Mpa |
| Elongation | 10-30 |
| Hardness | 80 Shore D |
| Strength | R/R |
| Tensile Modulus | 20 Mpa |
| Tensile Strength | >400 Mpa |
| Elongation | 4.5 Mpa |
| Hardness | 40% |
| Glass Transition Point | 55°C |
| Pot Life (Standard) | 180Sec |
| Cure Temp (?×time) | 70°C for 1-2Hours |
| Injection Extrusion | 20 Kg Bag |
Shape Memory Polymer Resin (Potting)
Shape memory polymer Resin Potting resin can be used in potting applications to encapsulate and protect electronic components, sensors, and other delicate devices. Potting involves filling or encapsulating these components with a protective material to shield them from environmental factors like moisture, dust, vibration, and mechanical damage.
Reworkable Electronics Potting
Easy Component Access: Smp Resin Potting resins can be designed to change shape or soften when exposed to a specific temperature, allowing easy access to encapsulated components for repairs or modifications. This reworkability is particularly valuable in applications where electronic components may need to be accessed for troubleshooting, upgrades, or replacements without damaging the surrounding materials.
Shock and Vibration Protection
Adaptive Cushioning: Shape memory polymer Resin Potting can provide adaptive cushioning for sensitive electronic components. When the components are subjected to shock or vibration, the SMP material can deform to absorb the impact and then return to its original shape, providing ongoing protection. This is particularly useful in automotive, aerospace, and industrial applications where equipment is exposed to harsh conditions.
Thermal Management
Shape-Responsive Heat Dissipation: Shape memory polymer Resin Potting can be engineered to change shape or properties in response to temperature changes, enhancing thermal management. For instance, the resin could expand or contract to improve heat dissipation from electronic components, helping to prevent overheating and extend the lifespan of the devices.
Sealing and Environmental Protection Shape memory polymer Resin Potting
Dynamic Seals: SMP resin can be used to create seals that adapt to environmental conditions. For example, the resin can expand in response to heat or moisture, improving the seal’s effectiveness and preventing ingress of contaminants. This dynamic sealing capability is especially beneficial in outdoor or industrial environments where temperature and humidity levels fluctuate.
