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Shape Memory Polymer Resin (Potting)

Shape Memory Polymer Resin (Potting)
Product No. NRE-54021
CAS 25038-59-9
Glass Transition temp 55°C
Melting Temp 200°C
Specific Gravity 1.25
Temperature Stability at 300°C
Tensile Strength ~13Mpa (Rubber Region)
Elongation >600%
Bending Modulus 1900 (Glassy Region)
Bending Strength 50MPa (Glassy Region)
Colour Tone Light Yellow
A/B Weight Ratio 40/60
Viscosity Sol A 360
Viscosity Sol B 300
Specific Gravity Sol A 1.062
Specific Gravity Sol B 1.215
Strength G/R
Bending Strength 75 Mpa
Bending Modulus 1800 Mpa
Tensile Strength 52 Mpa
Elongation 10-30
Hardness 80 Shore D
Strength R/R
Tensile Modulus 20 Mpa
Tensile Strength >400 Mpa
Elongation 4.5 Mpa
Hardness 40%
Glass Transition Point 55°C
Pot Life (Standard) 180Sec
Cure Temp (?×time) 70°C for 1-2Hours
Injection Extrusion 20 Kg Bag

Shape Memory Polymer Resin (Potting)

Shape memory polymer Resin Potting resin can be used in potting applications to encapsulate and protect electronic components, sensors, and other delicate devices. Potting involves filling or encapsulating these components with a protective material to shield them from environmental factors like moisture, dust, vibration, and mechanical damage.

Reworkable Electronics Potting

Easy Component Access: Smp Resin Potting resins can be designed to change shape or soften when exposed to a specific temperature, allowing easy access to encapsulated components for repairs or modifications. This reworkability is particularly valuable in applications where electronic components may need to be accessed for troubleshooting, upgrades, or replacements without damaging the surrounding materials.

 Shock and Vibration Protection

Adaptive Cushioning: Shape memory polymer Resin Potting can provide adaptive cushioning for sensitive electronic components. When the components are subjected to shock or vibration, the SMP material can deform to absorb the impact and then return to its original shape, providing ongoing protection. This is particularly useful in automotive, aerospace, and industrial applications where equipment is exposed to harsh conditions.

 Thermal Management

Shape-Responsive Heat Dissipation: Shape memory polymer Resin Potting can be engineered to change shape or properties in response to temperature changes, enhancing thermal management. For instance, the resin could expand or contract to improve heat dissipation from electronic components, helping to prevent overheating and extend the lifespan of the devices.

Sealing and Environmental Protection Shape memory polymer Resin Potting

Dynamic Seals: SMP resin can be used to create seals that adapt to environmental conditions. For example, the resin can expand in response to heat or moisture, improving the seal’s effectiveness and preventing ingress of contaminants. This dynamic sealing capability is especially beneficial in outdoor or industrial environments where temperature and humidity levels fluctuate.

 

 

 

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