Copper Sputtering Targets
Copper Sputtering Targets
Copper Sputtering Targets | |
Product No | NRE-43383 |
CAS No. | 7440-50-8 |
Formula | Cu |
Molecular Weight | 63.55 |
Purity | >99.9% |
Density | 8.96 g/cm³ |
Thickness | 3 mm ± 0.5mm (can be customized) |
Diameter | 50 mm ± 1mm (can be customized) |
Shape | Round |
Resistivity | NA |
Thermal Conductivity | NA |
Copper Sputtering Targets
Copper sputtering targets are versatile and used in various applications beyond the ones previously mentioned. Here are some additional and specific applications where copper sputtering targets play a crucial role.
Printed Circuit Boards (PCBs)
Application: Copper sputtering is used to deposit conductive layers on PCBs. The thin copper films help in forming the electrical connections between different components on the board.
Benefit: Ensures high conductivity and reliability of electrical signals on the PCB.
Magnetic Sensors and Devices
Application: Copper is used in the fabrication of thin film sensors and magnetic devices, including Hall Effect sensors and inductive sensors.
Benefit: Provides precise and stable magnetic and electrical properties.
MEMS (Micro-Electro-Mechanical Systems)
Application: Copper sputtering is employed in the production of MEMS devices, which are used in a range of applications from automotive sensors to consumer electronics.
Benefit: Contributes to the miniaturization and functionality of MEMS devices through precise deposition of copper layers.
RF (Radio Frequency) Devices
Application: In RF devices, copper sputtering targets are used to deposit conductive layers on substrates that are part of antennas and other RF components.
Benefit: Ensures efficient signal transmission and reception in RF communication systems.
High-Performance Computing (HPC)
Application: Copper sputtering is used to deposit layers in high-performance computing components, including processors and high-speed interconnects.
Benefit: Enhances the performance and speed of computing systems by improving electrical conductivity.
Wear-Resistant Coatings
Application: Copper sputtering targets are used to apply coatings that improve the wear resistance of mechanical components, such as bearings and gears.
Benefit: Extends the lifespan and durability of components subjected to friction and wear.
Battery Technologies
Application: In advanced battery technologies, copper is used in the fabrication of current collectors and other components. Sputtering helps in creating uniform and high-quality copper films.
Benefit: Improves the efficiency and performance of batteries, including lithium-ion batteries.
Electroplating and Surface Finishing
Application: Copper sputtering is sometimes used as a preparatory step before electroplating processes or surface finishing techniques.
Benefit: Provides a uniform and adherent base layer that enhances the quality of subsequent coatings or finishes.