Assembling incorporated circuit board, electronic gadgets, optical gadgets, radiator, high-temperature pot; Fabrication of metal framework and polymer network composites, particularly in the warmth seal cement and electronic bundling materials have wide application; High thermally conductive earthenware production; Composite pottery, e.g. vanishing watercraft; Heat sinks; Electrically protecting bundles for hardware; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer handling ( hurls, bearers)…
Aluminum Nitride Nanoparticles | |
Product No | NRE-5004 |
CAS No. | 24304-00-5 |
Formula | AlN |
APS | <100nm (Can be Customized) |
Purity | 99.9% |
Color | Off-White |
Molecular Weight | 40.982 g/mol |
Density | 3.260 g/cm3 |
Melting Point | 2200 °C |
Boiling Point | 2517 °C |
Aluminum Nitride Powder (AlN) Application:
Assembling incorporated circuit board, electronic gadgets, optical gadgets, radiator, high-temperature pot; Fabrication of metal framework and polymer network composites, particularly in the warmth seal cement and electronic bundling materials have wide application; High thermally conductive earthenware production; Composite pottery, e.g. vanishing watercraft; Heat sinks; Electrically protecting bundles for hardware; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer handling ( hurls, bearers)…