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Aluminum Silicon Copper Sputtering Targets

Aluminum Silicon Copper Sputtering Targets

Aluminum Silicon Copper Sputtering Targets
Product No NRE-43190
CAS No. NA
Formula AlSiCu
Molecular Weight NA
Purity >99.999%
Density NA
Thickness 3 mm ± 0.5mm (can be customized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Thermal Conductivity NA

Aluminum Silicon Copper Sputtering Targets

Aluminum silicon copper (Al-Si-Cu) sputtering targets are used to create thin films with a blend of properties from aluminum, silicon, and copper. This alloy is employed in several advanced technology and industrial applications due to its unique characteristics. Here’s an in-depth look at the applications and advantages of Al-Si-Cu sputtering targets.

Semiconductor Industry

Interconnects:

Application: Al-Si-Cu films are widely used as interconnects in semiconductor devices, such as integrated circuits (ICs) and microprocessors.

Benefits: Provides excellent electrical conductivity and mechanical reliability, crucial for connecting different components on a semiconductor chip.

Technical Detail: The alloy’s combination of aluminum with silicon and copper improves thermal and electrical performance while enhancing adhesion to the silicon substrate.

Barrier Layers:

Application: Used as barrier layers to prevent diffusion of metal into silicon or other materials in semiconductor devices.

Benefits: Protects the integrity of semiconductor components and prevents performance degradation due to metal diffusion.

Technical Detail: Silicon and copper in the alloy help in forming a stable barrier that effectively prevents unwanted diffusion and reaction.

Thin-Film Electronics

Conductive Layers:

Application: Employed as conductive layers in thin-film transistors (TFTs) and other electronic components.

Benefits: The alloy provides high electrical conductivity and stability, which is essential for the reliable operation of electronic devices.

Technical Detail: The alloy’s electrical properties are optimized for use in various thin-film electronic applications, improving overall device performance.

Heat Spreaders:

Application: Used in heat spreaders to manage thermal dissipation in electronic devices and components.

Benefits: Enhances thermal management by efficiently conducting heat away from sensitive areas, preventing overheating.

Technical Detail: The alloy’s thermal conductivity is improved by the addition of copper, which helps in effective heat spreading and management.

Optical Coatings

Reflective Coatings:

Application: Al-Si-Cu films are used in reflective coatings for optical devices such as mirrors and lenses.

Benefits: Provides high reflectivity and durability, making it suitable for high-performance optical systems.

Technical Detail: The alloy’s reflective properties are enhanced by the combined effects of aluminum and copper, resulting in efficient light reflection.

Anti-Reflective Coatings:

Application: Used to create anti-reflective coatings that reduce glare and enhance light transmission.

Benefits: Improves optical clarity and performance in applications such as eyeglasses, camera lenses, and displays.

 

 

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