Cobalt Sputtering Target (Baked With Indium Bonded, Purity: 99.99%)
Cobalt Sputtering Target
Cobalt Sputtering Target | |
Product No | NRE-43034 |
CAS No. | 7440-48-4 |
Formula | Co |
Molecular Weight | 58.93 g/mol |
Purity | 99.99% |
Density | 8.90 g/cm³ |
Thickness | 3 mm ± 0.5mm (can be customized) |
Diameter | 50 mm ± 1mm (can be customized) |
Shape | Round |
Resistivity | NA |
Thermal Expansion | NA |
Cobalt Sputtering Target
Cobalt sputtering targets are used in a variety of thin film deposition applications due to their unique properties. Here are some of the key applications.
Magnetic Thin Films: Cobalt is often used in magnetic thin films for hard disk drives, magnetic sensors, and other data storage devices. The magnetic properties of cobalt make it suitable for creating thin films with high magnetic coercivity and magnetoresistance.
Semiconductor Industry: Cobalt is used in the deposition of thin films for various semiconductor devices. It can be employed in the formation of contacts, interconnects, and barriers in integrated circuits.
Catalysis: Cobalt thin films are used in catalysis applications, particularly in the chemical industry. Cobalt-based catalysts are effective in various reactions, including the Fischer-Tropsch synthesis for converting syngas into liquid hydrocarbons.
Optical Coatings: Cobalt can be used in optical coatings to enhance properties such as reflectivity and durability.
Wear-Resistant Coatings: Cobalt-based coatings are applied to materials to improve their wear and corrosion resistance. This is useful in industries where components are subjected to harsh conditions, such as aerospace and automotive.
Solar Cells: Cobalt is sometimes used in thin film solar cells, particularly in conjunction with other materials to enhance efficiency and stability.
Biomedical Applications: Cobalt is used in biomedical coatings for implants and prosthetics. Its biocompatibility and resistance to corrosion make it suitable for these applications.
The sputtering process involves bombarding a target material (like cobalt) with ions, causing atoms to be ejected and deposited onto a substrate. This method is favored for its ability to create thin films with precise control over thickness and composition.