Our Products

DSP Silicon Wafer P Type
DSP Silicon Wafer P Type (12″,Boron Doped)
November 6, 2017
Sputtering Target Metallic Bond
Sputtering Target Metallic Bond ( Purity: 99.9%, Dia: 50 mm ± 1mm)
November 6, 2017
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OFE Copper Backing Plate


OFE Copper Backing Plate

OFE Copper Backing Plate
Product No. CAS Purity Thickness Dia Shape Form Composition
NRE-43050 NA >99.9% 0.125″ 60mm NA Plate Cu
Faceseal / Nosefoam NA
Product Type NA
Carbon Contents NA

A

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