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Tin Sulfide Sputtering Target (SnS, Purity: 99.99%, Dia: 50mm, Thickness: 3mm)

Tin Sulfide Sputtering Target
Product No NRE-43155
CAS No. 1314-95-0
Formula SnS
Molecular Weight 150.78g/mol
Purity >99.99%
Density 5.22g/cm3
Thickness 3 mm (can be customized)
Diameter 50 mm (can be customized)
Shape Round
Resistivity NA
Thermal Conductivity NA

Tin Sulfide Sputtering Target

Introduction

Tin sulfidesputtering target is a compound semiconductor known for its interesting electrical, optical, and thermal properties. It has gained attention for applications in various advanced technologies, especially in the field of thin films. Tin sulfide can exist in different crystalline forms, and sputtering is a common method for depositing thin films of SnS onto substrates, allowing for precise control over the material’s properties.

Applications

Photovoltaic Devices:

Tin sulfide is investigated for its potential use in thin-film solar cells due to its suitable bandgap, which allows for effective light absorption and conversion of solar energy into electricity.

Infrared Detectors:

SnS has favorable properties for use in infrared detection applications. Its ability to absorb infrared radiation makes it useful in thermal imaging and sensing technologies.

Optoelectronic Devices:

Tin sulfide can be utilized in optoelectronic applications, such as light-emitting diodes (LEDs) and laser diodes, especially in the mid-infrared range.

Thermoelectric Materials:

SnS exhibits promising thermoelectric properties, allowing for efficient conversion between heat and electricity, which is valuable for thermoelectric generators and coolers.

Thin-Film Transistors:

Tin sulfide is being explored for use in thin-film transistors (TFTs), which are important components in display technologies, providing flexibility and efficiency in electronic devices.

Catalytic Applications:

Tin sulfide can also serve as a catalyst in various chemical reactions, particularly in photocatalytic applications for environmental remediation and energy conversion.

Sputtering Process

The sputtering process for tin sulfide involves using a SnS target that, when bombarded with energetic ions, releases atoms for deposition onto substrates. .

 

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